跳转到内容
STAGING SERVER
DEVELOPMENT SERVER

Reference Design: Thermal Best Practices#

This topic provides a reference design for an optimum thermal design solution to help you to quickly implement effective cooling strategies during product development and deployment.

Thermal Reference Solution for STM-501u and STM-502u#

  • Active cooling: It's recommended to use fans for active cooling. Observe the following operating temperature ranges:
    • Laser diode module: <60 °C
    • IR module: <60 °C
    • RGB module: <60 °C
    • Temperatures of all chips on the motherboard: <70 °C

  • Passive cooling:

    • Apply graphite thermal pads on the side. It's recommended to use graphite thermal pads with specifications of 500 W or higher.

    Passive Cooling Using Thermal Pads

    • It's recommended to create ventilation holes on the outer casing to enhance cooling. The most effective directions for creating holes are vertically (top and bottom). If holes can't be placed on the top, consider placing them horizontally (left and right) and on the bottom for improved airflow.

    Ventilation Holes on Outer Casing

Thermal Reference Solution for STM-951u and STM-952u#

  • Active cooling: It's recommended to use fans for active cooling. Observe the following operating temperature ranges:
    • Laser diode module: <60 °C
    • IR module: <60 °C
    • RGB module: <60 °C
    • Temperatures of all chips on the motherboard: <70 °C

  • Passive cooling:

    • Apply graphite thermal pads on the side. It's recommended to use graphite thermal pads with specifications of 500 W or higher.

    Passive Cooling Using Thermal Pads

    • It's recommended to create ventilation holes on the casing to enhance cooling. The most effective directions for these holes are vertically (top and bottom). If holes can't be placed on the top, consider placing them horizontally (left and right) and on the bottom for improved airflow.

System Design Requirements#

  • Sealing requirements
    • Use foam padding or silicone seals between the 3D camera and your device to prevent dust entry.
  • Lens requirements
    • No additional lenses or covers can be added to the front of the 3D camera.
  • Cooling requirements
    • Connect the camera to external metal components using thermal conductive materials to expand the cooling area. It's recommended to incorporate active cooling with fans.
    • The cameras must not be heated by other heat sources.
  • Before customer tooling, please provide structural drawings related to the 3D camera for orbbec’s ME review.