提供散热#

您必须提供足够的散热以保持 Basler 的温度在指定范围内。

一般准则#

将镜头安装在相机上。
将相机安装在坚固的导热元件上。接触面应保持平整。如果表面不平整，在相机和接触表面之间贴上导热箔可能会有所帮助。
Attach appropriate cooling elements to the camera. Suitable cooling devices are available for most camera models and can be purchased via the Basler website.
让气流通过相机。
为了确保良好的图像质量，Basler 建议不要在高温下操作相机。
如果要检查相机温度，可以使用温度测量点直接在相机外壳上进行测量（请参阅下文）。
部分相机提供 Device Temperature 功能。此功能使您可以通过 pylon API 监视设备的温度。
请记住，更高的帧速率会增加功耗，从而导致更高的相机温度。
只要您的相机具有 Camera Operation Mode 功能，如果可接受以较低的帧速率运行，请将工作模式设置为长时间曝光以降低温度。

ace, ace 2, and racer 2 S Cameras#

信息

对于采用 Sony IMX 和 onsemi PYTHON 传感器的相机，可以遵照以下应用说明操作：如何监测 Basler ace 相机的外壳温度

温度测量点#

Housing Temperature Measurement Point for ace, ace 2, and racer 2 S Cameras

boost 相机#

温度测量点#

boost V 相机#

boost V 相机外壳温度测量点

boost R 相机#

Housing Temperature Measurement Point for boost R Cameras

racer 2 L Cameras#

On racer 2 L cameras, the temperature is best measured on the camera front. There is no specific measurement point.

Housing Temperature Measurement on racer 2 L Cameras

racer 2 L Cameras#

On racer 2 L cameras, the temperature is best measured on the camera front. There is no specific measurement point.

Housing Temperature Measurement on racer 2 L Cameras

dart 相机#

dart Classic/R/E#

所有 dart 相机模块的主板四角都有四个孔，用于安装模块。您也可以利用这些开孔来散热：

裸板机型：开孔处带有金属边框，用于将热量散发到所连接的金属元件。
S-mount 和 CS-mount 机型：铆钉位于四个孔中。这些铆钉可用于向连接的金属部件散热。例如，您可以将相机正面或背面连接到安装板。

如何使用边框或铆钉取决于您的系统设计。在所有情况下，请确保边框或铆钉与金属部件接触良好。

dart M#

On all dart M camera modules, there are four holes lined with a copper layer and located at the corners of the board. These holes are designed for installing the module (and the mount).
The dart M Screw Kit for Mount Attachment can be used for mounting the camera module.

CAUTION – Temperatures outside of the specified range may cause burns or lead to a camera shutdown.

Operating the camera module at temperatures outside of the range given in the camera specification causes the following problems:

The camera module gets hot and may cause burns when touching it.
Operating the camera module without heat dissipation may lead to a shutdown of the camera module in order to protect its electrical components.
The camera module's lifetime decreases.

Ensure sufficient heat dissipation. For more information, see the following section.

For dissipating heat, you have different possibilities, for example:

You can use the screws for mounting the dart M camera module onto a heat sink.
As the dart M mounts are of a high-performance plastic with good thermal conductivity, the mounts can be used for heat dissipation.
You have the option to connect a heat sink directly onto the surface of the FPGA. To enhance heat dissipation even further, consider connecting the heat sink to a metal case or housing.
Heat Sink for dart (for evaluation purposes only):
The heat sink can be attached to the FPGA of the camera module via the pre-installed glue pad.

In all cases:

If you use a heat conducting mat, you can further improve the heat dissipation.
Make sure that the electrically conductive component for dissipating the heat, doesn't touch the electrical contacts on the board.